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Robotics

MEMS

1986ActiveUpdated: 29 August 2026Published
Key innovation
Integration of moving mechanical elements and electronics on a single silicon chip via micromachining, shrinking inertial, pressure and acoustic sensors to the millimetre scale and enabling mass production.
Category
Robotics
Abstraction level
Building block
Operation level
DataRobot control
Use cases
Inertial measurement units (IMUs) in humanoid and mobile robotsStabilisation and navigation of drones (UAVs)Accelerometers in automotive airbag systemsGyroscopes and accelerometers in smartphonesMEMS microphones for speech recognition and beamformingScanning micromirrors in MEMS LiDARPressure sensors in barometers and medical systemsSensor fusion for orientation and locomotion estimation

How it works

A mechanical element — e.g. a proof mass suspended on silicon spring beams — is etched into silicon. Its motion under acceleration or rotation changes a measurable quantity, most commonly the capacitance between moving and fixed comb electrodes. Gyroscopes use a vibrating mass and the Coriolis effect to measure angular rate. An integrated read-out circuit (ASIC) converts the signals into digital data. In MEMS microphones a membrane deflects under acoustic pressure, and in scanning LiDAR an electrostatically actuated micromirror steers the laser beam. Signals from multiple sensors (e.g. accelerometer + gyroscope in an IMU) are combined via sensor fusion, typically a Kalman filter.

Problem solved

Classic inertial, pressure and acoustic sensors were large, expensive and power-hungry, preventing mass deployment in mobile devices and robots. MEMS miniaturise the mechanics to chip scale and integrate them with electronics in a single silicon process, drastically reducing size, cost and power consumption.