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QualcommDeployed

Qualcomm QCS8550

The Qualcomm QCS8550 (marketed as Qualcomm Dragonwing) is a system-on-chip aimed at robotics and IoT applications, built on the same silicon as the Snapdragon 8 Gen 2 (SM8550) mobile platform. It is manufactured on a 4 nm process.

Its compute section combines an octa-core Qualcomm Kryo CPU (1 Prime core at 3.2 GHz, 4 Performance cores at 2.8 GHz and 3 Efficiency cores at 2.0 GHz), a Qualcomm Adreno 740 GPU with hardware ray tracing, and a Qualcomm Hexagon NPU. The AI engine delivers up to 48 TOPS at INT8 precision (12 TOPS at FP16; up to 52 TOPS combined).

The SoC supports LPDDR5/LPDDR5X memory, video decode up to 8K and the AV1 codec. With on-device AI inference it is used, among others, as the onboard compute module of the FF Master Mini educational humanoid.

#SoC#Qualcomm#Snapdragon 8 Gen 2#edge AI#robotics#compute
Market classIndustrial

Classification

AI System-on-Chip (SoC) ยท serves as: Compute, AI Inference, Embedded main processor.

Which group Qualcomm QCS8550 belongs to and how it is built

4items
Compute
Hardware domain
Industrial
Market class

Covers integrated System-on-Chip circuits used as central processing units in embedded systems, robotics, AIoT, and edge AI devices. In this schema, parentCategory is set to 'other' because the parentCategory enum does not include a compute category.

Component type encompassing System-on-Chip designs used as primary compute units in embedded devices, edge AI, and robotics applications.

Technical specification

Process & package
2parameters
Process node
4nm
Package size
15,6 ร— 14mm
Updated: 22 September 2026